Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 58
Page 90
... POLYIMIDE n Tg = 432 OC g 12 PMDA / ODA POLYIMIDE n Tg > 450 oC CF3CF3 Tg = 460 oC N- CF3 6FXDA / 6FDA POLYIMIDE CF3 CF3 Tg = 360 oC 6F / DACH POLYIMIDE CF3 fofo - oto - o PMDA / 4 - BDAF POLYIMIDE n Tg = 310 oC Tm > 400 oC Figure 3 ...
... POLYIMIDE n Tg = 432 OC g 12 PMDA / ODA POLYIMIDE n Tg > 450 oC CF3CF3 Tg = 460 oC N- CF3 6FXDA / 6FDA POLYIMIDE CF3 CF3 Tg = 360 oC 6F / DACH POLYIMIDE CF3 fofo - oto - o PMDA / 4 - BDAF POLYIMIDE n Tg = 310 oC Tm > 400 oC Figure 3 ...
Page 255
... polyimide film as measured in situ during the curing and cooling cycles . Pads of 6 μm were patterned through the photosensitive polyimide at a sensitivity of 110 mJ / cm2 to i - line wavelength . The polyimide films exhibit anisotropy ...
... polyimide film as measured in situ during the curing and cooling cycles . Pads of 6 μm were patterned through the photosensitive polyimide at a sensitivity of 110 mJ / cm2 to i - line wavelength . The polyimide films exhibit anisotropy ...
Page 257
... polyimide film must be able to withstand high temperature operations although the back - end processing temperature is trending towards lower temperatures ( ~ 400 ° C ) . To evaluate the thermal stability of the polyimide , thermal ...
... polyimide film must be able to withstand high temperature operations although the back - end processing temperature is trending towards lower temperatures ( ~ 400 ° C ) . To evaluate the thermal stability of the polyimide , thermal ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch