Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 90
RESULTS AND DISCUSSION A variety of polyimides ( thermally stable matrix ) and labile blocks have been studied . ... PMDA / ODA has a T , well above 400 ° C and 5 8 CF3 -N Tg = 432 OC n PMDA / 3FDA POLYIMIDE Tg > 450 OC ooo 18 PMDAVODA ...
RESULTS AND DISCUSSION A variety of polyimides ( thermally stable matrix ) and labile blocks have been studied . ... PMDA / ODA has a T , well above 400 ° C and 5 8 CF3 -N Tg = 432 OC n PMDA / 3FDA POLYIMIDE Tg > 450 OC ooo 18 PMDAVODA ...
Page 255
PHYSICAL CHARACTERIZATION OF PHOTOSENSITIVE POLYIMIDE > Y.L. Zou * , T.L. Alford * , J.W. Mayer ** * Department of ... Arizona State University , Tempe , AZ 85287-1704 ABSTRACT Polyimides prepared from oxydiphthalic anhydride and ...
PHYSICAL CHARACTERIZATION OF PHOTOSENSITIVE POLYIMIDE > Y.L. Zou * , T.L. Alford * , J.W. Mayer ** * Department of ... Arizona State University , Tempe , AZ 85287-1704 ABSTRACT Polyimides prepared from oxydiphthalic anhydride and ...
Page 257
at a prism coupler sandwiched by two polyimide films [ 12 ] . The ordinary ( n . ) and extraordinary ( n . ) refractive indices were determined at an accuracy of +0.01 . RESULTS AND DISCUSSIONS Heat Resistance The polyimide film must be ...
at a prism coupler sandwiched by two polyimide films [ 12 ] . The ordinary ( n . ) and extraordinary ( n . ) refractive indices were determined at an accuracy of +0.01 . RESULTS AND DISCUSSIONS Heat Resistance The polyimide film must be ...
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Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer