Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 255
... polyimide films have been characterized with various techniques . The thermal decomposition temperature of the cured film ... polyimide film as measured in situ during the curing and cooling cycles . Pads of 6 μm were patterned through the ...
... polyimide films have been characterized with various techniques . The thermal decomposition temperature of the cured film ... polyimide film as measured in situ during the curing and cooling cycles . Pads of 6 μm were patterned through the ...
Page 257
at a prism coupler sandwiched by two polyimide films [ 12 ] . The ordinary ( n ) and extraordinary ( n ) refractive indices were determined at an accuracy of ± 0.01 . RESULTS AND DISCUSSIONS Heat Resistance The polyimide film must be ...
at a prism coupler sandwiched by two polyimide films [ 12 ] . The ordinary ( n ) and extraordinary ( n ) refractive indices were determined at an accuracy of ± 0.01 . RESULTS AND DISCUSSIONS Heat Resistance The polyimide film must be ...
Page 258
... polyimide film 5.0 μm thick on a silicon wafer was used for mechanical properties . Both the loading and unloading portions versus depth are shown in Figure 3. After 10 measurements , it was found the average hardness is 46.2 VHN with a ...
... polyimide film 5.0 μm thick on a silicon wafer was used for mechanical properties . Both the loading and unloading portions versus depth are shown in Figure 3. After 10 measurements , it was found the average hardness is 46.2 VHN with a ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch