Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 14
... polymer can greatly reduce the stress intensity at singular points in the interconnect pattern . Techniques , such as the creation of anisotropic structure in the polymer film , to control the interaction between the polymer film and ...
... polymer can greatly reduce the stress intensity at singular points in the interconnect pattern . Techniques , such as the creation of anisotropic structure in the polymer film , to control the interaction between the polymer film and ...
Page 52
polymer was studied by TGA under isothermal conditions at different temperatures and in different atmospheres ... polymer precursor changed to an orange color . The part of the polymer film not exposed to UV was then washed off with a ...
polymer was studied by TGA under isothermal conditions at different temperatures and in different atmospheres ... polymer precursor changed to an orange color . The part of the polymer film not exposed to UV was then washed off with a ...
Page 145
... polymers generally have a greater propensity for in - plane molecular alignment than flexible chain polymers resulting in relatively more anisotropic electrical , thermal , and mechanical properties . The flexible polymer interline and ...
... polymers generally have a greater propensity for in - plane molecular alignment than flexible chain polymers resulting in relatively more anisotropic electrical , thermal , and mechanical properties . The flexible polymer interline and ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch