Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
From inside the book
Results 1-3 of 48
Page 141
... films that are mounted in a tensile tester and pulled . However , very brittle films are difficult to prepare as ... polymer substrate , PMDA - ODA [ 3 ] . The polymer substrate inhibits crack propagation and allows the sample film to be ...
... films that are mounted in a tensile tester and pulled . However , very brittle films are difficult to prepare as ... polymer substrate , PMDA - ODA [ 3 ] . The polymer substrate inhibits crack propagation and allows the sample film to be ...
Page 145
... polymer interline and MIM capacitance results at 1 MHz ( measured △ ɛ ) are consistent with refractive index data on blanket films at optical frequencies ( An ) which show that the film is relatively isotropic , Table 1. An estimate of ...
... polymer interline and MIM capacitance results at 1 MHz ( measured △ ɛ ) are consistent with refractive index data on blanket films at optical frequencies ( An ) which show that the film is relatively isotropic , Table 1. An estimate of ...
Page 161
CHEMICAL - MECHANICAL POLISHING OF POLYMER FILMS : COMPARISON OF BENZOCYCLOBUTENE ( BCB ) AND PARYLENE - N FILMS BY XPS AND AFM G.-R. Yang , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ** Center for ...
CHEMICAL - MECHANICAL POLISHING OF POLYMER FILMS : COMPARISON OF BENZOCYCLOBUTENE ( BCB ) AND PARYLENE - N FILMS BY XPS AND AFM G.-R. Yang , Y.-P. Zhao * , Jan M. Neirynck ** , Shyam P. Murarka *** , and Ronald J. Gutmann ** Center for ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
34 other sections not shown
Other editions - View all
Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch