Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 4
... polymerization [ 4 ] . This catalyst can control the polymerization of bulky monomers to form saturated olefinic polymers with high Tg's . The polymerization mechanism enables a high degree of control over stereoselectivity ( i.e. how ...
... polymerization [ 4 ] . This catalyst can control the polymerization of bulky monomers to form saturated olefinic polymers with high Tg's . The polymerization mechanism enables a high degree of control over stereoselectivity ( i.e. how ...
Page 52
polymer was studied by TGA under isothermal conditions at different temperatures and in different atmospheres ... polymer precursor changed to an orange color . The part of the polymer film not exposed to UV was then washed off with a ...
polymer was studied by TGA under isothermal conditions at different temperatures and in different atmospheres ... polymer precursor changed to an orange color . The part of the polymer film not exposed to UV was then washed off with a ...
Page 145
... polymer interline and MIM capacitance results at 1 MHz ( measured △ ɛ ) are consistent with refractive index data ... polymer agrees well with the estimated Aɛ as expected , but there is a large discrepancy for the rod - like polymer ...
... polymer interline and MIM capacitance results at 1 MHz ( measured △ ɛ ) are consistent with refractive index data ... polymer agrees well with the estimated Aɛ as expected , but there is a large discrepancy for the rod - like polymer ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch