Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 4
... polymerization of bulky monomers to form saturated olefinic polymers with high Tg's . The polymerization mechanism enables a high degree of control over stereoselectivity ( i.e. how the monomers are linked together ) and molecular ...
... polymerization of bulky monomers to form saturated olefinic polymers with high Tg's . The polymerization mechanism enables a high degree of control over stereoselectivity ( i.e. how the monomers are linked together ) and molecular ...
Page 14
... polymer . However , this approach can also produce a corresponding anisotropy in the dielectric constant which negates the advantage of the polymer as a dielectric material . Also , anisotropic polymers with a low CTE in the plane of ...
... polymer . However , this approach can also produce a corresponding anisotropy in the dielectric constant which negates the advantage of the polymer as a dielectric material . Also , anisotropic polymers with a low CTE in the plane of ...
Page 145
... polymers generally have a greater propensity for in - plane molecular alignment than flexible chain polymers resulting in relatively more anisotropic electrical , thermal , and mechanical properties . The flexible polymer interline and ...
... polymers generally have a greater propensity for in - plane molecular alignment than flexible chain polymers resulting in relatively more anisotropic electrical , thermal , and mechanical properties . The flexible polymer interline and ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch