Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 10
... Preparation Polymer coatings on silicon wafers were prepared by conventional spin coating and thermal curing . Spin coating was performed on a CEE Model 4000 bench top spin coater . Prepolymer solution was dispensed both with hand ...
... Preparation Polymer coatings on silicon wafers were prepared by conventional spin coating and thermal curing . Spin coating was performed on a CEE Model 4000 bench top spin coater . Prepolymer solution was dispensed both with hand ...
Page 114
... prepared by spin - coating onto 3 " Si and SiO2 wafers for thin film property measurements or onto 200 mm wafers for integration studies . Prior to spin - coating , all wafers were treated with an aminosilane - based adhesion promoter ...
... prepared by spin - coating onto 3 " Si and SiO2 wafers for thin film property measurements or onto 200 mm wafers for integration studies . Prior to spin - coating , all wafers were treated with an aminosilane - based adhesion promoter ...
Page 116
... prepared from pure NMP solvent to those prepared with additive systems 1 and 2. Most notably , formulations containing gap fill additives have higher dielectric constant and significantly reduced elongation - at - break than the ...
... prepared from pure NMP solvent to those prepared with additive systems 1 and 2. Most notably , formulations containing gap fill additives have higher dielectric constant and significantly reduced elongation - at - break than the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch