Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 13
Page 95
... present in the PMDA / 4 - BDAF foams would help to give foams with high thermal stability and perhaps > 30 % voids . Though we were able to generate PMDA / 4 - BDAF foams with high porosities ( 24 % ) , they were found to undergo ...
... present in the PMDA / 4 - BDAF foams would help to give foams with high thermal stability and perhaps > 30 % voids . Though we were able to generate PMDA / 4 - BDAF foams with high porosities ( 24 % ) , they were found to undergo ...
Page 105
... present in the as - cast film . Curing was found to increase the adhesion between the xerogel and the silicon substrate . Moisture was found to be responsible for an increase in the dielectric constant . That is , in ambient , the ...
... present in the as - cast film . Curing was found to increase the adhesion between the xerogel and the silicon substrate . Moisture was found to be responsible for an increase in the dielectric constant . That is , in ambient , the ...
Page 129
... present a novel electrical technique to estimate the in - plane dielectric constant of DuPont FPI - 136M fluorinated polyimide without requiring dielectric gapfill . A blanket FPI - 136M film is deposited over interdigitated inlaid Al ...
... present a novel electrical technique to estimate the in - plane dielectric constant of DuPont FPI - 136M fluorinated polyimide without requiring dielectric gapfill . A blanket FPI - 136M film is deposited over interdigitated inlaid Al ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch