Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 36
... presented suggests that the film density decreases upon heating . Density reduction could play a major role in the change of K and tan 8. Changes in the infrared spectrum show that there is post - heating creation of C = C groups in the ...
... presented suggests that the film density decreases upon heating . Density reduction could play a major role in the change of K and tan 8. Changes in the infrared spectrum show that there is post - heating creation of C = C groups in the ...
Page 233
... tester . Measurements where taken at four separate points on the wafer . Five wafers of each type were used . The mean of the twenty readings is reported . RESULTS AND DISCUSSION Adhesion Stud pull test results are presented 233.
... tester . Measurements where taken at four separate points on the wafer . Five wafers of each type were used . The mean of the twenty readings is reported . RESULTS AND DISCUSSION Adhesion Stud pull test results are presented 233.
Page 278
... presented at the 1996 MRS Fall Meeting , Boston , MA , 1985 ( unpublished ) . 5 ) N. Hayasaka , H. Miyajima , Y. Nakasaki and R. Katsumaa : Ext . Abts . 1995 Int . Conf . Solid State Device and Materials ( Business Center for Acad . Soc ...
... presented at the 1996 MRS Fall Meeting , Boston , MA , 1985 ( unpublished ) . 5 ) N. Hayasaka , H. Miyajima , Y. Nakasaki and R. Katsumaa : Ext . Abts . 1995 Int . Conf . Solid State Device and Materials ( Business Center for Acad . Soc ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch