Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 12
A wide range of thickness is possible depending on the formulation . Films up to 12 um in thickness have been coated in a single spin application . Thermal Stability Processability at 450 ° C was one of the main specifications for the ...
A wide range of thickness is possible depending on the formulation . Films up to 12 um in thickness have been coated in a single spin application . Thermal Stability Processability at 450 ° C was one of the main specifications for the ...
Page 80
An oxidation mechanism has been proposed , which is able to explain consistently a range of experimental data . The oxygen from the dielectric materials can result in oxidation of the contacted metal layers , both on the surface and ...
An oxidation mechanism has been proposed , which is able to explain consistently a range of experimental data . The oxygen from the dielectric materials can result in oxidation of the contacted metal layers , both on the surface and ...
Page 100
The best quality aerogel spheres within a size range 1.5-2.0mm were hand selected from a batch for this study . The diameters of the spheres were measured by two methods , micrometry and microscopy ; the two measurement quantities were ...
The best quality aerogel spheres within a size range 1.5-2.0mm were hand selected from a batch for this study . The diameters of the spheres were measured by two methods , micrometry and microscopy ; the two measurement quantities were ...
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Contents
Polynorbornene for Lowk Interconnection | 3 |
High Thermal Stability for ULSI Interlayer Dielectric | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
addition adhesion analysis annealing applications atoms bond capacitance chamber chemical coating compared concentration copolymers cost cured curve cycle decrease density dependence deposited determined device dielectric constant diffusion DISCUSSION effect electrical electron energy etch etch rate experiments Figure flow fluorine formed function groups heating higher improved increase indicate integrated interconnect interface layer less lines loss low dielectric constant lower materials measured mechanical metal mode modulus moisture observed obtained occurs oxide oxygen PA-N peak performance plasma polishing polyimide polymer pressure Proc properties range ratio reaction reduced refractive index relative Research resistance respectively sample shown shows Si-F signal silicon SiO2 SiOF films solution spectra strength stress structure substrate surface Table Teflon temperature TEOS thermal thermal stability thickness thin films treatment wafer