Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 12
... range of thickness is possible depending on the formulation . Films up to 12 μm in thickness have been coated in a single spin application . Thermal Stability Processability at 450 ° C was one of the main specifications for the project ...
... range of thickness is possible depending on the formulation . Films up to 12 μm in thickness have been coated in a single spin application . Thermal Stability Processability at 450 ° C was one of the main specifications for the project ...
Page 80
... range . An oxidation mechanism has been proposed , which is able to explain consistently a range of experimental data . The oxygen from the dielectric materials can result in oxidation of the contacted metal layers , both on the surface ...
... range . An oxidation mechanism has been proposed , which is able to explain consistently a range of experimental data . The oxygen from the dielectric materials can result in oxidation of the contacted metal layers , both on the surface ...
Page 100
... range of measured densities , having a mean value of 148 kg / m3 and a range of +/- 2.2 kg / m3 . Drying and moisture calibration The following procedure was used to prepare the aerogel spheres with quantitative concentrations of ...
... range of measured densities , having a mean value of 148 kg / m3 and a range of +/- 2.2 kg / m3 . Drying and moisture calibration The following procedure was used to prepare the aerogel spheres with quantitative concentrations of ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch