Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 40
... reaction is a redistribution reaction , which is a multistep thermally activated reaction with reported products of volatile silane and silica " . Oxidation is another conversion reaction which involves an intermediary silanol phase ...
... reaction is a redistribution reaction , which is a multistep thermally activated reaction with reported products of volatile silane and silica " . Oxidation is another conversion reaction which involves an intermediary silanol phase ...
Page 79
... reaction mechanism . B2N- | 4,1 OCT бо △ , -H2O OCE OCT TFMOB for opt OCF 3 Fig . 5. Synthetic scheme for fluorinated polyimide [ 15 , 17 ] . -NE Fast ramp annealing Slow ramp annealing оо O O O O Low - k Al2O3 ΑΙ Fig . 6. Schematic ...
... reaction mechanism . B2N- | 4,1 OCT бо △ , -H2O OCE OCT TFMOB for opt OCF 3 Fig . 5. Synthetic scheme for fluorinated polyimide [ 15 , 17 ] . -NE Fast ramp annealing Slow ramp annealing оо O O O O Low - k Al2O3 ΑΙ Fig . 6. Schematic ...
Page 261
... reaction with F which diffused from the FSG film was observed under optical microscopy . This reaction caused TiSi2 delamination . Electrical characterization of devices was performed before and after the thermal stability test ...
... reaction with F which diffused from the FSG film was observed under optical microscopy . This reaction caused TiSi2 delamination . Electrical characterization of devices was performed before and after the thermal stability test ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch