Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 33
Page 124
... refractive index . Increasing the e - beam dose from 3 to 10 mC / cm2 causes the refractive index to increase significantly compared to the thermal cure . Still higher refractive indices were found when films were first thermally cured ...
... refractive index . Increasing the e - beam dose from 3 to 10 mC / cm2 causes the refractive index to increase significantly compared to the thermal cure . Still higher refractive indices were found when films were first thermally cured ...
Page 259
... refractive indices in three orthogonal directions , two in - plane and one out - of - plane refractive indices , can be determined with ATR . For spin coated films , the two in - plane refractive indices are the same and hence the ...
... refractive indices in three orthogonal directions , two in - plane and one out - of - plane refractive indices , can be determined with ATR . For spin coated films , the two in - plane refractive indices are the same and hence the ...
Page 280
... refractive index and film stress on the wet etch rate was investigated . Films were deposited using both high and low flow processes with various C2F / TEOS ratios . Figure 1 shows that the compressive stress decreases as the refractive ...
... refractive index and film stress on the wet etch rate was investigated . Films were deposited using both high and low flow processes with various C2F / TEOS ratios . Figure 1 shows that the compressive stress decreases as the refractive ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch