Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 9
... relative humidity at room temperature . a trademark of The Dow Chemical Company INTRODUCTION Spin - on organic dielectrics offer the possibility for increasing interconnect performance while increasing manufacturing throughput and ...
... relative humidity at room temperature . a trademark of The Dow Chemical Company INTRODUCTION Spin - on organic dielectrics offer the possibility for increasing interconnect performance while increasing manufacturing throughput and ...
Page 64
... relative ratio of Cu ( 2p3 / 2 ) to polymeric C ( 1s ) decreased from about 0.28 at 300 K to 0.18 upon annealing to 600 K. It has been reported that a disproportionation reaction occurs with precursors of the type Cu ( hfac ) L ( where ...
... relative ratio of Cu ( 2p3 / 2 ) to polymeric C ( 1s ) decreased from about 0.28 at 300 K to 0.18 upon annealing to 600 K. It has been reported that a disproportionation reaction occurs with precursors of the type Cu ( hfac ) L ( where ...
Page 277
... relative to the respective corresponding plots in Figs . 4 ( a ) , ( b ) and ( c ) . - Figs . 5 ( a ) , ( b ) and ( c ) , display the squares of the IR effective charges for the bond - stretching , bond - bending and bond - rocking ...
... relative to the respective corresponding plots in Figs . 4 ( a ) , ( b ) and ( c ) . - Figs . 5 ( a ) , ( b ) and ( c ) , display the squares of the IR effective charges for the bond - stretching , bond - bending and bond - rocking ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch