Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 138
ratio of the substrate material , respectively , and t , the t , are the substrate and film thickness , respectively . The moduli of Si and GaAs are 131 and 85.5 GPa , respectively . The slope of the stress - temperature curve is ...
ratio of the substrate material , respectively , and t , the t , are the substrate and film thickness , respectively . The moduli of Si and GaAs are 131 and 85.5 GPa , respectively . The slope of the stress - temperature curve is ...
Page 277
... respective corresponding plots in Figs . 4 ( a ) , ( b ) and ( c ) . - Figs . 5 ( a ) , ( b ) and ( c ) , display the squares of the IR effective charges for the bond - stretching , bond - bending and bond - rocking modes , respectively ...
... respective corresponding plots in Figs . 4 ( a ) , ( b ) and ( c ) . - Figs . 5 ( a ) , ( b ) and ( c ) , display the squares of the IR effective charges for the bond - stretching , bond - bending and bond - rocking modes , respectively ...
Page 295
... respectively to examine the interdiffusion and reactions at each interface in the multilayer . The SiOF film underwent the post plasma treatment for 5 min and the thickness of Cu and TiN were 500 Å and 400 Å , respectively . The ...
... respectively to examine the interdiffusion and reactions at each interface in the multilayer . The SiOF film underwent the post plasma treatment for 5 min and the thickness of Cu and TiN were 500 Å and 400 Å , respectively . The ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch