Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 58
Page 76
... samples , DSC was employed to isothermally anneal the samples at different temperatures for 60 min with a ramp rate of 500 ° C / min under a high purity nitrogen atmosphere . One sample was thermally treated with a ramp rate of 2 ° C ...
... samples , DSC was employed to isothermally anneal the samples at different temperatures for 60 min with a ramp rate of 500 ° C / min under a high purity nitrogen atmosphere . One sample was thermally treated with a ramp rate of 2 ° C ...
Page 263
... samples . Compared with the pre - anneal test result , where all samples passed the test , the data indicate a degradation in adhesion for all the Ti- on - FSG and some of TiN - on - FSG samples . Both SIMS and adhesion results suggest ...
... samples . Compared with the pre - anneal test result , where all samples passed the test , the data indicate a degradation in adhesion for all the Ti- on - FSG and some of TiN - on - FSG samples . Both SIMS and adhesion results suggest ...
Page 280
... samples and samples that had been etched in 100 : 1 H2O : HF solution . For each condition , as - deposited and etched samples were taken from adjacent die near the center of the same wafer . As - deposited samples were decorated for en ...
... samples and samples that had been etched in 100 : 1 H2O : HF solution . For each condition , as - deposited and etched samples were taken from adjacent die near the center of the same wafer . As - deposited samples were decorated for en ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch