Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 67
Page 31
... shown for F : H ratios of 1.5 , which result in films with a dielectric constant of ~ 2.4 after heating . INTRODUCTION For interconnect structures used in ULSI applications , one promising class of materials for interlayer dielectric ...
... shown for F : H ratios of 1.5 , which result in films with a dielectric constant of ~ 2.4 after heating . INTRODUCTION For interconnect structures used in ULSI applications , one promising class of materials for interlayer dielectric ...
Page 143
... shown in Figure 7. A mesh , which defines the simulation resolution , is laid over the model ; a small piece of the mesh is shown in Figure 7. Each point on the mesh , point A for example , must satisfy the LaPlace equation modified to ...
... shown in Figure 7. A mesh , which defines the simulation resolution , is laid over the model ; a small piece of the mesh is shown in Figure 7. Each point on the mesh , point A for example , must satisfy the LaPlace equation modified to ...
Page 186
... shown in figures 1 and 2. It can be appreciated that the two classes of fluoropolymers shown in these Non she CF3 CĘ CE2 CF CF2 CF CF2 CF CF C CF2 C C CF CF. CF CF CF3 CF3 Figure 1- structure of a typical fluoropolymer film [ 3 ] ...
... shown in figures 1 and 2. It can be appreciated that the two classes of fluoropolymers shown in these Non she CF3 CĘ CE2 CF CF2 CF CF2 CF CF C CF2 C C CF CF. CF CF CF3 CF3 Figure 1- structure of a typical fluoropolymer film [ 3 ] ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch