Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 33
... Figure 3 : Dielectric constant at 105 Hz as a function of a thermal soak at 400 ° C in 4 Torr Ar . The growth ... shown in Figure 4 , shows a marked decrease upon heating . The initial value is around 0.12 , then drops to 0.035 and ...
... Figure 3 : Dielectric constant at 105 Hz as a function of a thermal soak at 400 ° C in 4 Torr Ar . The growth ... shown in Figure 4 , shows a marked decrease upon heating . The initial value is around 0.12 , then drops to 0.035 and ...
Page 143
... shown in Figure 7. A mesh , which defines the simulation resolution , is laid over the model ; a small piece of the mesh is shown in Figure 7. Each point on the mesh , point A for example , must satisfy the LaPlace equation modified to ...
... shown in Figure 7. A mesh , which defines the simulation resolution , is laid over the model ; a small piece of the mesh is shown in Figure 7. Each point on the mesh , point A for example , must satisfy the LaPlace equation modified to ...
Page 157
... illustrated in figure 2. They are directly related to material removal in a CMP process . A typical AE rms signal in a steady state CMP process and with the lowest load ( the polishing head pressure = 0.15 psi ) is shown in figure 3. It ...
... illustrated in figure 2. They are directly related to material removal in a CMP process . A typical AE rms signal in a steady state CMP process and with the lowest load ( the polishing head pressure = 0.15 psi ) is shown in figure 3. It ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch