Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 19
Page 45
... Signal , Inc. , Advanced Microelectronic Materials , 3500 Garrett Drive , Santa Clara , CA 95054 ABSTRACT SOG etchback was studied using Applied Materials ' 200mm MxP + etch chamber on Allied Signal's SOG ( spin - on - glass ) T11 and ...
... Signal , Inc. , Advanced Microelectronic Materials , 3500 Garrett Drive , Santa Clara , CA 95054 ABSTRACT SOG etchback was studied using Applied Materials ' 200mm MxP + etch chamber on Allied Signal's SOG ( spin - on - glass ) T11 and ...
Page 157
... signal from the polishing . The raw AE signal was fed through a preamplifier with fixed 60 dB gain and built - in high - pass filter with 50 KHz corner frequency . This output was further amplified by a Dunegan amplifier with 20 dB gain ...
... signal from the polishing . The raw AE signal was fed through a preamplifier with fixed 60 dB gain and built - in high - pass filter with 50 KHz corner frequency . This output was further amplified by a Dunegan amplifier with 20 dB gain ...
Page 158
... signal 0 5 10 15 20 25 30 Running time ( s ) Fig . 2 The AE sources in a CMP process Fig . 3 Typical AErms signal in a CMP process rms ( v ) 0.5 0.45 Load = 0.15psi 0.4 0.35 0.3 0.25 0.2 0.15- 0.1 0.05 Typical AE rms signal 10 15 20 25 ...
... signal 0 5 10 15 20 25 30 Running time ( s ) Fig . 2 The AE sources in a CMP process Fig . 3 Typical AErms signal in a CMP process rms ( v ) 0.5 0.45 Load = 0.15psi 0.4 0.35 0.3 0.25 0.2 0.15- 0.1 0.05 Typical AE rms signal 10 15 20 25 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch