Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 99
... silica aerogels are among the lowest measured for any solid material . The silica aerogels also exhibit low thermal expansion and are thermally stable to temperatures exceeding 500 ° C . However , due to the open porosity and large ...
... silica aerogels are among the lowest measured for any solid material . The silica aerogels also exhibit low thermal expansion and are thermally stable to temperatures exceeding 500 ° C . However , due to the open porosity and large ...
Page 103
... silica aerogel . The maximum amount of water that was sorbed by the silica aerogel after 150 hours exposed to 85 % RH was about 28 wt . % . The difference in the value of the dielectric constants between the dried aerogel and the 28 wt ...
... silica aerogel . The maximum amount of water that was sorbed by the silica aerogel after 150 hours exposed to 85 % RH was about 28 wt . % . The difference in the value of the dielectric constants between the dried aerogel and the 28 wt ...
Page 105
... silica as an on - chip dielectric material is attractive for its predicted low dielectric constant ( models suggest values less than 2.012 ) . Also , porous silica uses similar precursors ( e.g. tetraethoxysilane , TEOS ) as those used ...
... silica as an on - chip dielectric material is attractive for its predicted low dielectric constant ( models suggest values less than 2.012 ) . Also , porous silica uses similar precursors ( e.g. tetraethoxysilane , TEOS ) as those used ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch