Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 52
Page 5
... silicon , silicon dioxide , aluminum , silver , gold , and copper and pass the tape test even after being placed in boiling water for two hours . R Figure 1. Generic polynorbornene structure Although properties such as Tg and low ...
... silicon , silicon dioxide , aluminum , silver , gold , and copper and pass the tape test even after being placed in boiling water for two hours . R Figure 1. Generic polynorbornene structure Although properties such as Tg and low ...
Page 22
mechanisms depend on the step coverage of silicon oxide deposition . In the conformal silicon oxide deposition process ( poor step coverage behavior ) , pinholes were formed at narrow line space patterns . Therefore , silicon oxide ...
mechanisms depend on the step coverage of silicon oxide deposition . In the conformal silicon oxide deposition process ( poor step coverage behavior ) , pinholes were formed at narrow line space patterns . Therefore , silicon oxide ...
Page 265
... silicon / TiSi2 pads in one of the wafers in Experiment 1. As discussed previously , F atoms may diffuse through the inter - layer dielectric ( ILD ) stack and react with TiSi2 , causing TiSi2 film delamination . According to the ...
... silicon / TiSi2 pads in one of the wafers in Experiment 1. As discussed previously , F atoms may diffuse through the inter - layer dielectric ( ILD ) stack and react with TiSi2 , causing TiSi2 film delamination . According to the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch