Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 37
... silsesquioxane since it affects structure and properties of the spin on dielectric material . Reported herein is the effect of soak temperature , time , and oxygen concentration process parameters on structure and properties of hydrogen ...
... silsesquioxane since it affects structure and properties of the spin on dielectric material . Reported herein is the effect of soak temperature , time , and oxygen concentration process parameters on structure and properties of hydrogen ...
Page 40
... silsesquioxane such that densification may result upon conversion . Concomitant with densification are undesirable effects such as increased stress levels and increased dielectric constant . In addition , susceptibility to moisture ...
... silsesquioxane such that densification may result upon conversion . Concomitant with densification are undesirable effects such as increased stress levels and increased dielectric constant . In addition , susceptibility to moisture ...
Page 43
... silsesquioxane . Dielectric constant data deviating from model is attributed to cure processing under oxidative conditions producing polar silanol and water species . Norm . SIH Bond Density , % 25 25 500 75 100 8 0 350 0.5 400 450 ...
... silsesquioxane . Dielectric constant data deviating from model is attributed to cure processing under oxidative conditions producing polar silanol and water species . Norm . SIH Bond Density , % 25 25 500 75 100 8 0 350 0.5 400 450 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch