Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 37
... similar or improved properties . Shorter cure times result in similar structure and properties as the baseline cure which suggests that lower temperature and / or shorter cure time may provide value worth investigating by integrated ...
... similar or improved properties . Shorter cure times result in similar structure and properties as the baseline cure which suggests that lower temperature and / or shorter cure time may provide value worth investigating by integrated ...
Page 145
... similar rigid rod - like polymer , BPDA - PDA , confined in a 0.6 μm wide trench [ 9 ] . Another study of BPDA - PDA in > 10 μm wide trenches showed that the film was much more anisotropic like the blanket film [ 10 ] . These ...
... similar rigid rod - like polymer , BPDA - PDA , confined in a 0.6 μm wide trench [ 9 ] . Another study of BPDA - PDA in > 10 μm wide trenches showed that the film was much more anisotropic like the blanket film [ 10 ] . These ...
Page 213
... similar thickness showed a dependence on the deposition conditions . The films deposited at a low vaporizer temperature exhibit a smooth surface ( RMS ~ 4 nm ) while those deposited at high vaporizer temperature have a rougher surface ...
... similar thickness showed a dependence on the deposition conditions . The films deposited at a low vaporizer temperature exhibit a smooth surface ( RMS ~ 4 nm ) while those deposited at high vaporizer temperature have a rougher surface ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch