Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 34
... spectra at 30 and 45 minutes were identical to the one at 60 minutes . Cure of Hydrogen Silsesquioxane for ... spectra after normalizing them with respect to film thickness . Figure 7 shows normalized FTIR spectra of a -40V bias 1.5 F ...
... spectra at 30 and 45 minutes were identical to the one at 60 minutes . Cure of Hydrogen Silsesquioxane for ... spectra after normalizing them with respect to film thickness . Figure 7 shows normalized FTIR spectra of a -40V bias 1.5 F ...
Page 63
... spectra were acquired in the fixed pass energy mode at 50 eV pass energy , using Mg Ka radiation .. The spectra discussed here were recorded with the analyzer aligned along the sample normal . Procedures for analysis of XPS data have ...
... spectra were acquired in the fixed pass energy mode at 50 eV pass energy , using Mg Ka radiation .. The spectra discussed here were recorded with the analyzer aligned along the sample normal . Procedures for analysis of XPS data have ...
Page 64
... spectra recorded after annealing to 600 K ( not shown ) show some remnant of hfac ligands on the surface , consistent with the notion that not all the Cu ( I ) hfac species has been consumed by the disproportionation reaction . 10.11 Cu ...
... spectra recorded after annealing to 600 K ( not shown ) show some remnant of hfac ligands on the surface , consistent with the notion that not all the Cu ( I ) hfac species has been consumed by the disproportionation reaction . 10.11 Cu ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch