Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 52
... coating solution to increase the photo - sensitivity of the coatings . The solution was then spin - coated onto a Si wafer . Samples of the photo - sensitive Chemat - B coatings were placed in a silica jar . A thin metal mask was placed ...
... coating solution to increase the photo - sensitivity of the coatings . The solution was then spin - coated onto a Si wafer . Samples of the photo - sensitive Chemat - B coatings were placed in a silica jar . A thin metal mask was placed ...
Page 114
... spin - coating onto 3 " Si and SiO2 wafers for thin film property measurements or onto 200 mm wafers for integration ... coated substrates were then dried at 110 ° C for 60 sec . Fluorinated polyimide precursor ( polyamic acid ) solution was ...
... spin - coating onto 3 " Si and SiO2 wafers for thin film property measurements or onto 200 mm wafers for integration ... coated substrates were then dried at 110 ° C for 60 sec . Fluorinated polyimide precursor ( polyamic acid ) solution was ...
Page 259
... spin coated films , the two in - plane refractive indices are the same and hence the anisotropy can be characterized by birefringence defined as the difference between the in - plane and out - of - plane indices [ 14 ] . Five samples of ...
... spin coated films , the two in - plane refractive indices are the same and hence the anisotropy can be characterized by birefringence defined as the difference between the in - plane and out - of - plane indices [ 14 ] . Five samples of ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch