Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 66
Page 51
... stability , good high temperature stability , easy processing , and low H2O absorption and outgassing . In this research , a new material system has been studied . This process - controlled low - k material can have dielectric constant ...
... stability , good high temperature stability , easy processing , and low H2O absorption and outgassing . In this research , a new material system has been studied . This process - controlled low - k material can have dielectric constant ...
Page 197
... stability , and permittivity . We discovered that a copolymer of tetravinyl - tetramethyl - cyclotetrasiloxane and Parylene - N has a permittivity of close to 2.1 and both the adhesion to SiO2 and thermal stability are measurably ...
... stability , and permittivity . We discovered that a copolymer of tetravinyl - tetramethyl - cyclotetrasiloxane and Parylene - N has a permittivity of close to 2.1 and both the adhesion to SiO2 and thermal stability are measurably ...
Page 261
... stability of the FSG film and its impact on device reliability remain a concern for this application . In this study , SIMS , SEM , and optical microscope analyses were carried out to evaluate the thermal stability of the FSG films and ...
... stability of the FSG film and its impact on device reliability remain a concern for this application . In this study , SIMS , SEM , and optical microscope analyses were carried out to evaluate the thermal stability of the FSG films and ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch