Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 29
Page 51
... strength , good dimensional stability , good high temperature stability , easy processing , and low H2O absorption and outgassing . In this research , a new material system has been studied . This process - controlled low - k material ...
... strength , good dimensional stability , good high temperature stability , easy processing , and low H2O absorption and outgassing . In this research , a new material system has been studied . This process - controlled low - k material ...
Page 82
Adhesion strength ( N ) 0 Cu / Pl evacuating the chamber to base pressure , the metal films were deposited from Cu ... strength ( critical load for delamination ) of Cu and CuTi films on PI . CuTi films have significantly large critical ...
Adhesion strength ( N ) 0 Cu / Pl evacuating the chamber to base pressure , the metal films were deposited from Cu ... strength ( critical load for delamination ) of Cu and CuTi films on PI . CuTi films have significantly large critical ...
Page 235
... Strength , MV / cm Strength , MV / cm Quenched Leakage , nA / cm2 @ 0.2 MV / cm 0.01 * > 1.0 0.01 * , 0.1-0.3 ** 2.42 0.86 0.01 * 1.6 0.01 *** Lab MIM 0.01 * 2.1 - 4.0 Taiwan NDL MIM External * * < 0.5 micron thickness ** 0.5 nA / cm2 ...
... Strength , MV / cm Strength , MV / cm Quenched Leakage , nA / cm2 @ 0.2 MV / cm 0.01 * > 1.0 0.01 * , 0.1-0.3 ** 2.42 0.86 0.01 * 1.6 0.01 *** Lab MIM 0.01 * 2.1 - 4.0 Taiwan NDL MIM External * * < 0.5 micron thickness ** 0.5 nA / cm2 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch