Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 19
... structure in order to enhance resistance to oxygen plasma . This study describes adhesion failure mechanisms for the sandwiched fluorinated amorphous carbon film ( a - C : F ) structure during oxygen plasma annealing . We have found 3 ...
... structure in order to enhance resistance to oxygen plasma . This study describes adhesion failure mechanisms for the sandwiched fluorinated amorphous carbon film ( a - C : F ) structure during oxygen plasma annealing . We have found 3 ...
Page 117
... structure . In addition to delamination , blister defects have also been observed after the cure of the FPI layer deposited over patterned metal . Figure 4 is an optical micrograph illustrating large blisters occurring in a region of ...
... structure . In addition to delamination , blister defects have also been observed after the cure of the FPI layer deposited over patterned metal . Figure 4 is an optical micrograph illustrating large blisters occurring in a region of ...
Page 186
... structure of a typical fluoropolymer film [ 3 ] obtained by PE - CVD of fluorinated monomers ( PE - CVD - fluoropolymer ) figures are completely different . In one case ( fig . 1 ) we face a scrambled structure with variable F / C ratio ...
... structure of a typical fluoropolymer film [ 3 ] obtained by PE - CVD of fluorinated monomers ( PE - CVD - fluoropolymer ) figures are completely different . In one case ( fig . 1 ) we face a scrambled structure with variable F / C ratio ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch