Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 48
... studied with SiON which is a better moisture barrier , as a liner . Initial SiON etch experiments with the gas flow CF4 / CHF3 = 22sccm / 66sccm using the process recipe given in Tab . 1 showed that there was significant polymer ...
... studied with SiON which is a better moisture barrier , as a liner . Initial SiON etch experiments with the gas flow CF4 / CHF3 = 22sccm / 66sccm using the process recipe given in Tab . 1 showed that there was significant polymer ...
Page 90
... studied are shown in Figure 2. PMDA / 3FDA has a very high T。( ≈430 ° C ) and is soluble in its fully imidized ... studying the semicrystalline ordered polyimide , PMDA / 4 - BDAF.8 One of the challenges in the development of nanofoams ...
... studied are shown in Figure 2. PMDA / 3FDA has a very high T。( ≈430 ° C ) and is soluble in its fully imidized ... studying the semicrystalline ordered polyimide , PMDA / 4 - BDAF.8 One of the challenges in the development of nanofoams ...
Page 147
... studied for the same film . It is observed that the dielectric strength of the film decreases at first and then increases above 4 MPa of compressive stress . INTRODUCTION 2,3 Polymeric films have become quintessential in the electronics ...
... studied for the same film . It is observed that the dielectric strength of the film decreases at first and then increases above 4 MPa of compressive stress . INTRODUCTION 2,3 Polymeric films have become quintessential in the electronics ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch