Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 138
... substrate and the film . respectively . This equation has two unknowns preventing the determination of af and Mf from the data collected using a single substrate , Si . Using second substrate , GaAs , results in a second equation ...
... substrate and the film . respectively . This equation has two unknowns preventing the determination of af and Mf from the data collected using a single substrate , Si . Using second substrate , GaAs , results in a second equation ...
Page 142
... Substrate 200 Stress - Strain Curve 100 0 0.00 0.02 0.04 0.06 0.08 0.1 Strain Figure 4 : The averaged force - strain curves for the PMDA - ODA substrate film and the FPI / substrate composite film . The substrate curve is the average of ...
... Substrate 200 Stress - Strain Curve 100 0 0.00 0.02 0.04 0.06 0.08 0.1 Strain Figure 4 : The averaged force - strain curves for the PMDA - ODA substrate film and the FPI / substrate composite film . The substrate curve is the average of ...
Page 174
... substrates . Instrumentation details of the curvature measurement are described by Ryan [ 3 ] and is omitted here . Substrate - curvature vs. temperature data for the thick PETEOS were acquired over mul- tiple thermal cycles . At the ...
... substrates . Instrumentation details of the curvature measurement are described by Ryan [ 3 ] and is omitted here . Substrate - curvature vs. temperature data for the thick PETEOS were acquired over mul- tiple thermal cycles . At the ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch