Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 76
... temperature axis of the instrument was calibrated from the melting endotherms of pure zinc and indium standards as long as there were no changes in operating conditions . 2 The x - ray diffractometry ( XRD ) measurements were carried ...
... temperature axis of the instrument was calibrated from the melting endotherms of pure zinc and indium standards as long as there were no changes in operating conditions . 2 The x - ray diffractometry ( XRD ) measurements were carried ...
Page 122
... temperature and dielectric constant . Different levels of e - beam dose were used in this work . EXPERIMENTAL A general synthesis of poly ( arylene ethers ) has been described elsewhere [ 8 ] . Thin films of this polymer were formed on ...
... temperature and dielectric constant . Different levels of e - beam dose were used in this work . EXPERIMENTAL A general synthesis of poly ( arylene ethers ) has been described elsewhere [ 8 ] . Thin films of this polymer were formed on ...
Page 223
temperature control is especially challenging when one considers that the wafer temperature depends on the clamping quality as well as the chuck temperature . 10000 9000 8000 7000 6000 DEPOSITION RATE , A / mi 5000 130 140 150 160 170 ...
temperature control is especially challenging when one considers that the wafer temperature depends on the clamping quality as well as the chuck temperature . 10000 9000 8000 7000 6000 DEPOSITION RATE , A / mi 5000 130 140 150 160 170 ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch