Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 17
Page 227
... thermal stress measurements show a large hysteresis that occurs after the first thermal cycle ( first heating and cooling curve ) , Figure 5. No hysteresis is observed in subsequent thermal cycles which nearly overlay the first cooling ...
... thermal stress measurements show a large hysteresis that occurs after the first thermal cycle ( first heating and cooling curve ) , Figure 5. No hysteresis is observed in subsequent thermal cycles which nearly overlay the first cooling ...
Page 229
... thermal cycle , but shift is very much smaller in subsequent thermal cycles . Film properties which constantly change with multiple thermal cycles are an important process integration issue , and the bending beam and DSC results ...
... thermal cycle , but shift is very much smaller in subsequent thermal cycles . Film properties which constantly change with multiple thermal cycles are an important process integration issue , and the bending beam and DSC results ...
Page 230
The reversible stress inflection in the thermal stress - temperature curve ... thermal cycle of the as - deposited film , but these experiments indicate ... cycles after the first . ACKNOWLEDGEMENTS The authors gratefully acknowledge ...
The reversible stress inflection in the thermal stress - temperature curve ... thermal cycle of the as - deposited film , but these experiments indicate ... cycles after the first . ACKNOWLEDGEMENTS The authors gratefully acknowledge ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch