Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Results 1-3 of 45
Page 31
Thermal Stability of a - C : F , H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition Jeremy A. Theil , Francoise Mertz , Micah Yairi , Karen Seaward , Gary Ray , and Gerrit Kooi HP Laboratories ...
Thermal Stability of a - C : F , H Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition Jeremy A. Theil , Francoise Mertz , Micah Yairi , Karen Seaward , Gary Ray , and Gerrit Kooi HP Laboratories ...
Page 197
... thermal stability above 400 Celsius , and 3 ) permittivity less than 2.7 . Parylene - N has been incorporated into both aluminum - 1 and copper - 2 based metallization schemes , however , improvements in the adhesion and thermal ...
... thermal stability above 400 Celsius , and 3 ) permittivity less than 2.7 . Parylene - N has been incorporated into both aluminum - 1 and copper - 2 based metallization schemes , however , improvements in the adhesion and thermal ...
Page 261
... thermal stability of the FSG film and its impact on device reliability remain a concern for this application . In this study , SIMS , SEM , and optical microscope analyses were carried out to evaluate the thermal stability of the FSG ...
... thermal stability of the FSG film and its impact on device reliability remain a concern for this application . In this study , SIMS , SEM , and optical microscope analyses were carried out to evaluate the thermal stability of the FSG ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch