Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 81
MATERIAL AND INTERFACE CHARACTERIZATION OF Cu99Ti1 THIN FILMS METALLIZED ON POLYIMIDE * E. Kondoh and T.P. Nguyen ' ** * IMEC , Kapeldreef 75 , 3001 Leuven , Belgium ... Thin Films Metallized on Polyimide E Kondoh and T P Nguyen.
MATERIAL AND INTERFACE CHARACTERIZATION OF Cu99Ti1 THIN FILMS METALLIZED ON POLYIMIDE * E. Kondoh and T.P. Nguyen ' ** * IMEC , Kapeldreef 75 , 3001 Leuven , Belgium ... Thin Films Metallized on Polyimide E Kondoh and T P Nguyen.
Page 235
... thin ( < 0.5 μm ) oven cooled films had breakdown field strengths less then 0.01 MV / cm . This is essentially the same as air . However , films which were slightly thicker ( 0.7 - 1.1 μm ) had strengths over one order of magnitude ...
... thin ( < 0.5 μm ) oven cooled films had breakdown field strengths less then 0.01 MV / cm . This is essentially the same as air . However , films which were slightly thicker ( 0.7 - 1.1 μm ) had strengths over one order of magnitude ...
Page 267
... thin films passivated by fluorinated silicon dioxide ( SiOF ) during repetitive thermal cycling are investigated . The amount of stress relaxation , elastic and plastic behavior of these thin film structures are compared . Ti and TiN ...
... thin films passivated by fluorinated silicon dioxide ( SiOF ) during repetitive thermal cycling are investigated . The amount of stress relaxation , elastic and plastic behavior of these thin film structures are compared . Ti and TiN ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch