Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 3
... transition temperature polynorbornenes are being developed which provide many of these desired features . This polymer family is produced via a new transition metal catalyzed polymerization . Attributes which make polynorbornene ...
... transition temperature polynorbornenes are being developed which provide many of these desired features . This polymer family is produced via a new transition metal catalyzed polymerization . Attributes which make polynorbornene ...
Page 9
... transition temperature for the fully cured film is greater than 490 ° C . The coefficient of thermal expansivity is 66 ppm / ° C below the glass transition temperature . The stress in fully cured films on Si wafers is ca. 60 MPa at room ...
... transition temperature for the fully cured film is greater than 490 ° C . The coefficient of thermal expansivity is 66 ppm / ° C below the glass transition temperature . The stress in fully cured films on Si wafers is ca. 60 MPa at room ...
Page 230
... transition because they appear at nearly the same temperatures as the phase transition peaks in the DSC heating ( 288 ° C ) and cooling ( 255 ° C ) curves . CONCLUSION Parylene - N films deposited using modifications of the Gorham ...
... transition because they appear at nearly the same temperatures as the phase transition peaks in the DSC heating ( 288 ° C ) and cooling ( 255 ° C ) curves . CONCLUSION Parylene - N films deposited using modifications of the Gorham ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch