Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 33
... values for these films is about 0.050 . This 0 10 20 30 40 50 60 Time ( min ) Figure 4 : Loss tangent at 105 Hz as a ... value . Some of the films have a dielectric constant around 2.4 . For the same film , the tan 8 , shown in Figure 4 ...
... values for these films is about 0.050 . This 0 10 20 30 40 50 60 Time ( min ) Figure 4 : Loss tangent at 105 Hz as a ... value . Some of the films have a dielectric constant around 2.4 . For the same film , the tan 8 , shown in Figure 4 ...
Page 234
... values for HMDS and aminopropyldimethylmethoxysilane ( APMS ) are the lowest of the treated samples . Both of these materials are essentially monofunctional . The trialkoxysilanes have considerably higher stud pull values . Particularly ...
... values for HMDS and aminopropyldimethylmethoxysilane ( APMS ) are the lowest of the treated samples . Both of these materials are essentially monofunctional . The trialkoxysilanes have considerably higher stud pull values . Particularly ...
Page 277
... values of ß , 155 to 180 degrees . Finally , the values of the ( e * ) 2's for the bond - rocking modes are relatively constant over a large range of ẞ , from about 120 to 180 degrees , and in addition the values of ( e * ) 2 are ...
... values of ß , 155 to 180 degrees . Finally , the values of the ( e * ) 2's for the bond - rocking modes are relatively constant over a large range of ẞ , from about 120 to 180 degrees , and in addition the values of ( e * ) 2 are ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch