Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 162
... vapor deposition system , with a base pressure approximately about 2 × 10 Torr and deposition pressure approximately 45 55 mTorr . The wafers were 5 inch Si ( 100 ) wafers . Before deposition , a layer of adhesion promoter A - 174 ...
... vapor deposition system , with a base pressure approximately about 2 × 10 Torr and deposition pressure approximately 45 55 mTorr . The wafers were 5 inch Si ( 100 ) wafers . Before deposition , a layer of adhesion promoter A - 174 ...
Page 207
... vapor deposition ( CVD ) technique for the deposition of DuPont's Teflon amorphous fluoropolymer 1600 ( bulk K = 1.93 ) using the principle of direct liquid injection . The processing was carried out with and without an ultra violet ...
... vapor deposition ( CVD ) technique for the deposition of DuPont's Teflon amorphous fluoropolymer 1600 ( bulk K = 1.93 ) using the principle of direct liquid injection . The processing was carried out with and without an ultra violet ...
Page 213
THE EFFECT OF DEPOSITION CONDITIONS ON THE PROPERTIES OF VAPOR- DEPOSITED PARYLENE AF - 4 FILMS M. A. PLANO , D. KUMAR and T. J. CLEARY Novellus Systems Inc. , 3970 N. First St. , San Jose , CA 95134 ABSTRACT One potential low ...
THE EFFECT OF DEPOSITION CONDITIONS ON THE PROPERTIES OF VAPOR- DEPOSITED PARYLENE AF - 4 FILMS M. A. PLANO , D. KUMAR and T. J. CLEARY Novellus Systems Inc. , 3970 N. First St. , San Jose , CA 95134 ABSTRACT One potential low ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch