Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 45
... various SOG and liner films are tunable in a wide range allowing optimization of IMD planarization . INTRODUCTION In semiconductor fabrication , spin - on materials are used for submicron gap fill and IMD planarization due to their ...
... various SOG and liner films are tunable in a wide range allowing optimization of IMD planarization . INTRODUCTION In semiconductor fabrication , spin - on materials are used for submicron gap fill and IMD planarization due to their ...
Page 49
... various SOGS ( T11,418 ) relative to various liner films ( TEOS , A - SION , and B - SION ) vs. gas flow ratio CF4 / CHF3 . 1.5 ETCH RATE SELECTIVITY 1.25 -T11 / TEOS OT11 / A - SION -T11 / B - SION ] 418 / TEOS 0.75 418 / A - SION 0.5 ...
... various SOGS ( T11,418 ) relative to various liner films ( TEOS , A - SION , and B - SION ) vs. gas flow ratio CF4 / CHF3 . 1.5 ETCH RATE SELECTIVITY 1.25 -T11 / TEOS OT11 / A - SION -T11 / B - SION ] 418 / TEOS 0.75 418 / A - SION 0.5 ...
Page 93
... various blocks . Block copolymer containing various amounts of labile block were obtained though we concentrated our efforts on copolymers containing 15-30 % ( vol ) labile block with the hope that these would afford the best nanofoams ...
... various blocks . Block copolymer containing various amounts of labile block were obtained though we concentrated our efforts on copolymers containing 15-30 % ( vol ) labile block with the hope that these would afford the best nanofoams ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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1997 Materials Research adhesion aerogel annealing atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k Materials Research Society measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene out-of-plane oxide oxygen parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Symp Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI wafer wet etch