Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 157
... wafer carrier , a polishing pad , a polishing platen of 400 mm diameters , and a slurry supply system . The wafer , which moves circularly along the pad and self - rotates while in a CMP process , is held face down by the carrier which ...
... wafer carrier , a polishing pad , a polishing platen of 400 mm diameters , and a slurry supply system . The wafer , which moves circularly along the pad and self - rotates while in a CMP process , is held face down by the carrier which ...
Page 158
... Wafer Metal interconnects Dielectric layer Slurry particle Polishing pad Micro indentation / three body abrasion Micro scratching / two body abrasion 0.9 Dissolution of abraded chips 0.8 Dissolution of oxide 0.7- rms ( v ) 0.6 0.5 0.4 ...
... Wafer Metal interconnects Dielectric layer Slurry particle Polishing pad Micro indentation / three body abrasion Micro scratching / two body abrasion 0.9 Dissolution of abraded chips 0.8 Dissolution of oxide 0.7- rms ( v ) 0.6 0.5 0.4 ...
Page 262
... wafers . Prior to the deposition , the radius of Si wafer curvature was pre - measured in a Tencor FLEXUS 2900 system . During the experiment , the radius of the wafer curvature was measured at different temperatures . The temperature ...
... wafers . Prior to the deposition , the radius of Si wafer curvature was pre - measured in a Tencor FLEXUS 2900 system . During the experiment , the radius of the wafer curvature was measured at different temperatures . The temperature ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch