Low-dielectric Constant Materials, Volume 476Materials Research Society, 1997 - Electric insulators and insulation |
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Page 280
... etch solution . Etch rates on patterned wafers were measured by comparing SEM photographs of " as - deposited " samples and samples that had been etched in 100 : 1 H2O : HF solution . For each ... Wet Etch Rate ( Å / min . ) Wet 280.
... etch solution . Etch rates on patterned wafers were measured by comparing SEM photographs of " as - deposited " samples and samples that had been etched in 100 : 1 H2O : HF solution . For each ... Wet Etch Rate ( Å / min . ) Wet 280.
Page 281
Wet Etch Rate ( Å / min . ) Wet etch rates of these films were expected to depend on both refractive index ( fluorine content ) and stress . Figure 2 shows that the wet etch rates of undoped TEOS oxide films increase as the stress is ...
Wet Etch Rate ( Å / min . ) Wet etch rates of these films were expected to depend on both refractive index ( fluorine content ) and stress . Figure 2 shows that the wet etch rates of undoped TEOS oxide films increase as the stress is ...
Page 283
... etch rate of the sidewall during deposition decreases slightly as the feature size decreases . It may also be related to a change in the TEOS surface mobility as C2F6 is added to the process . CONCLUSIONS While the wet etch of undoped ...
... etch rate of the sidewall during deposition decreases slightly as the feature size decreases . It may also be related to a change in the TEOS surface mobility as C2F6 is added to the process . CONCLUSIONS While the wet etch of undoped ...
Contents
Polynorbornene for Lowk Interconnection | 3 |
SILK Polymer Coating With LowDielectric Constant | 9 |
F During Oxygen Plasma Annealing | 19 |
Copyright | |
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Common terms and phrases
adhesion aerogel annealing as-deposited atoms BCB film bond BPDA-PDA capacitance Chemat-B chemical cm¹ CMP process coating copolymers cured films curve decrease delamination density deposition rate device dielectric constant dielectric material diffusion e-beam cured effect electron Figure film stress film thickness films deposited fluorinated polyimide fluorine fluoropolymer FSG films FTEOS films FTIR gap fill glass transition temperature heating in-plane increase integrated circuits interface labile block layer low dielectric constant low-k measured mechanical metal lines modulus moisture Multilevel Interconnection norbornene optical out-of-plane oxide oxygen PA-N film parylene Parylene-N peak PECVD Phys planarization plasma plasma treatment polishing polyimide polymer polymerization precursor pressure Proc properties PTFE ratio reaction refractive index sample shows Si-F Si-O-Si silica silicon SiO2 SiOF films slurry spectra spin-coated spin-on structure substrate surface Teflon-AF temperature TEOS thermal cycles thermal stability thin films ULSI vapor wafer wet etch