Proceedings: ISTFA, International Symposium for Testing and Failure AnalysisATFA, Incorporated, 1993 - Electronic apparatus and appliances |
Contents
Localization of PellicleInduced Open Contacts Using ChargeInduced Voltage Alteration | 1 |
The Identification of Isolated Pockets of Trace Metallic Contaminants and Unambiguous Correlation with PMIC Failures | 9 |
Analysis of Thin Films and Interfaces by AngleLap Auger Depth Profiling | 19 |
Copyright | |
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19th International Symposium aluminum array Auger capacitor Carafe cause cell cerdip chip CMOS contamination copper filaments cross section crystal cycle defect deposition depth profiles device diagnosis electromigration electron emission epoxy etch failure analysis failure mechanism fault diagnosis fault dictionary fault lists film focused ion beam gate oxide glass grain boundary Iddq identified IEEE input inspection integrated circuits interconnect interface ISTFA 93 JTAG laser latchup layer leakage currents material measured metal method microcontrollers micrograph microscopy mode module nitride node observed optical output package passivation polysilicon probe Proc region reliability resistance sample scan scan chain scanning electron microscope semiconductor shipping tube shown in Figure shows signal silicon SIMS simulation solder sputter steam age structure substrate surface Symposium for Testing technique temperature Testing & Failure thermal transistor vector VLSI voltage wafer waveform wordline