Proceedings: ISTFA, International Symposium for Testing and Failure AnalysisATFA, Incorporated, 1993 - Electronic apparatus and appliances |
Contents
Localization of PellicleInduced Open Contacts Using ChargeInduced Voltage Alteration | 1 |
The Identification of Isolated Pockets of Trace Metallic Contaminants and Unambiguous Correlation with PMC Failures | 9 |
Analysis of Thin Films and Interfaces by AngleLap Auger Depth Profiling | 19 |
Copyright | |
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19th International Symposium aluminum applied array bondpads capacitor cause cell cerdip chip CMOS contact resistance contamination cross section crystal crystal oscillator cycle defect deposition deprocessing depth profiles device electrical test electromigration electron emission epoxy etch failure analysis failure mechanism fault diagnosis fault dictionary fault lists ferroelectric film focused ion beam gate oxide grain boundary Iddq IEEE input inspection integrated circuits interconnect interface ISTFA 93 JTAG laser latch-up layer leakage currents material measured metal method microcontroller micrograph microscope mode module moisture nitride node OBIC OBIRCH observed optical oscillator output package passivation performed polysilicon ppmv probe region reliability sample scan scanning electron microscope semiconductor shown in Figure shows signal silicon simulation solder sputter structure substrate surface Symposium for Testing technique temperature Testing & Failure thermal transistor tungsten vector VLSI voltage wafer waveform wordline