Engineering materials and their applications
This edition of the classic text/reference book has been updated and revised to provide balanced coverage of metals, ceramics, polymers and composites. The first five chapters assess the different structures of metals, ceramics and polymers and how stress and temperature affect them. Demonstrates how to optimize a material's structure by using equilibrium data (phase diagrams) and nonequilibrium conditions, especially precipitation hardening. Discusses the structures, characteristics and applications of the important materials in each field. Considers topics common to all materials—corrosion and oxidation, failure analysis, processing of electrical and magnetic materials, materials selection and specification. Contains special chapters on advanced and large volume engineering materials plus abundant examples and problems.
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The electron hole (charge = 1.6 x 10~ 19 coul). In Chapter 7, we discussed "~
Briefly tKe~concept of an electron hole in the (Fe2+, Fe3+)O2~ lattice. Associated
with each Fe3+ ion there is an electron hole, a place to which a traveling electron
Diamond, therefore, is a good insulator, whereas the small number of conduction
- band electrons in silicon and germanium leads us to ... 14.8 (a) Formation of a
conduction electron and an electron hole in pure silicon (intrinsic semiconductor).
Electron hole due to Al (with only three electrons I in the outer shell) Si Si I Si Si 1
t ^ Conduction band Si Al Si Si Eg Intrinsic 1 Electron hole — ^— — o from Al ''', . .
g Valence band Si Si Si Si (a) (b) Fig. 14.10 (a) Structure of silicon with an ...
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The Problem of Materials Selection and Development
Metallic Structures The Unit Cell
Effects of Stress and Temperature on Simple Metal
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