Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 196
... GPa . An earlier processing run with a similar process has a best - fit Young's modulus of 140 GPa , somewhat lower than that from the data of Table 1 . Optical and electrical measurements of the quality factor Q are plotted in Fig . 4 ...
... GPa . An earlier processing run with a similar process has a best - fit Young's modulus of 140 GPa , somewhat lower than that from the data of Table 1 . Optical and electrical measurements of the quality factor Q are plotted in Fig . 4 ...
Page 661
... Fig . 5 remove etch stop remove etch stop ed d t ( MPa ) 140 120 100 80 60 O ... GPa , resulting in a residual stress - to - modulus ratio of 0.003 . This ... Fig . 6 ( Top view ) 8 W Schematic top - view of axial beam released structure ...
... Fig . 5 remove etch stop remove etch stop ed d t ( MPa ) 140 120 100 80 60 O ... GPa , resulting in a residual stress - to - modulus ratio of 0.003 . This ... Fig . 6 ( Top view ) 8 W Schematic top - view of axial beam released structure ...
Page 665
... GPa NO 31.5 MPa = 0 50 DEFLECTION 100 150 microns Figure 3. Model fitted to typical load - deflection data E + 1.6649 No wo pa = 0.5469 where No is the intrinsic stress , E is Young's mod- ulus , p is the differential pressure and t is ...
... GPa NO 31.5 MPa = 0 50 DEFLECTION 100 150 microns Figure 3. Model fitted to typical load - deflection data E + 1.6649 No wo pa = 0.5469 where No is the intrinsic stress , E is Young's mod- ulus , p is the differential pressure and t is ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
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alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus