Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 157
... ( LPCVD LTO ) is used to form the sacrificial layers and LPCVD Si3N4 is used as an electrical isolation layer for the micromachined structure . 7 : 1 , NH4F : HF buffered HF ( BHF ) , 48 wt % concentrated hydrofluoric acid ( LHF ) , and ...
... ( LPCVD LTO ) is used to form the sacrificial layers and LPCVD Si3N4 is used as an electrical isolation layer for the micromachined structure . 7 : 1 , NH4F : HF buffered HF ( BHF ) , 48 wt % concentrated hydrofluoric acid ( LHF ) , and ...
Page 669
... LPCVD Si3NA 790 0.6 20 : 170 LPCVD poly - Si 630 0.4 Sill : N 4 2 20 : 110 Sill : N 4 2 plasma - CVD Si3N4 300 0.5 15 : 535 CCD CAMERA OPTICAL FIBER He / Ne LASER O TV MONITOR X - Y PLOTTER COMPUTER MICROSCOPE Composite Membrane ...
... LPCVD Si3NA 790 0.6 20 : 170 LPCVD poly - Si 630 0.4 Sill : N 4 2 20 : 110 Sill : N 4 2 plasma - CVD Si3N4 300 0.5 15 : 535 CCD CAMERA OPTICAL FIBER He / Ne LASER O TV MONITOR X - Y PLOTTER COMPUTER MICROSCOPE Composite Membrane ...
Page 681
... LPCVD at 650 ° C patterned with the first mask ( Fig . 3 ( b ) ) . The layer serves as the underlying electrode and as the ground plane to all the structures . A 800 Å - thick LPCVD Si , N4 is the third step of the process ( Fig . 3 ( c ) ...
... LPCVD at 650 ° C patterned with the first mask ( Fig . 3 ( b ) ) . The layer serves as the underlying electrode and as the ground plane to all the structures . A 800 Å - thick LPCVD Si , N4 is the third step of the process ( Fig . 3 ( c ) ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
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alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus