Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 672
... Fracture Toughness Characterization of Brittle Thin Films , " Vol . 2 , pp . 872-874 , June 1990. © Elsevier Sequoia . SPIRAL MICROSTRUCTURES FOR THE MEASUREMENT OF AVERAGE STRAIN GRADIENTS IN. L. S. FAN , R. T. HOWE and R. S. MULLER ...
... Fracture Toughness Characterization of Brittle Thin Films , " Vol . 2 , pp . 872-874 , June 1990. © Elsevier Sequoia . SPIRAL MICROSTRUCTURES FOR THE MEASUREMENT OF AVERAGE STRAIN GRADIENTS IN. L. S. FAN , R. T. HOWE and R. S. MULLER ...
Page 673
... FRACTURE Fig . 2. SEM of a 15 um wide bridge with a C - shaped stress concentrator in the center . 100 Microns Accel : 19.75kv Mag : Width ... fractured specimen . Conclusions A simple one - mask technique for characterizing fracture. 673.
... FRACTURE Fig . 2. SEM of a 15 um wide bridge with a C - shaped stress concentrator in the center . 100 Microns Accel : 19.75kv Mag : Width ... fractured specimen . Conclusions A simple one - mask technique for characterizing fracture. 673.
Page 674
... fracture design parameters has been applied to tensile - stressed LPCVD silicon nitride films . The design parameter obtained is the critical geometry parameter , which can be converted into fracture toughness by multiplying by the ...
... fracture design parameters has been applied to tensile - stressed LPCVD silicon nitride films . The design parameter obtained is the critical geometry parameter , which can be converted into fracture toughness by multiplying by the ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
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alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus