Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Results 1-3 of 86
Page 40
... oxide but not the remaining photoresist or the silicon . The result is a pattern of openings in the oxide that duplicates the metal pattern on the glass plate . In subsequent processing steps the oxide pattern serves as a mask for the ...
... oxide but not the remaining photoresist or the silicon . The result is a pattern of openings in the oxide that duplicates the metal pattern on the glass plate . In subsequent processing steps the oxide pattern serves as a mask for the ...
Page 53
... OXIDE MASK • 97.5 μM +++ ( 100 ) ODE 68 MIN . 80 C. 69μM DEEP . WIDTH AT OXIDE MASK 975 μ Fig . 13. ( 100 ) ODE , 38- and 68 - min etching . 180 X SEM 1,200 X 80 SEM Fig . 12. Corner faceting in ( 100 ) ODE , 50 μm deep . jecting out ...
... OXIDE MASK • 97.5 μM +++ ( 100 ) ODE 68 MIN . 80 C. 69μM DEEP . WIDTH AT OXIDE MASK 975 μ Fig . 13. ( 100 ) ODE , 38- and 68 - min etching . 180 X SEM 1,200 X 80 SEM Fig . 12. Corner faceting in ( 100 ) ODE , 50 μm deep . jecting out ...
Page 510
... oxide step : Using high - pressure oxidation , a 4.0- μm - thick layer of thermal oxide is grown at 850 ° C . A photolithography step is used to remove the oxide where the flow channel walls are to be fabricated . A second pho ...
... oxide step : Using high - pressure oxidation , a 4.0- μm - thick layer of thermal oxide is grown at 850 ° C . A photolithography step is used to remove the oxide where the flow channel walls are to be fabricated . A second pho ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
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alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus