Micromechanics and MEMS: Classic and Seminal Papers to 1990William S. Trimmer Micromechanics is a rich, diverse field that draws on many different disciplines and has potential applications in medicine, electronic interfaces to physical phenomena, military, industrial controls, consumer products, airplanes, microsatellites, and much more. Until now, papers written during the earlier stages of this field have been difficult to retrieve. The papers included in this volume have been thoughtfully arranged by topic, and are accompanied by section introductions written by renowned expert William Trimmer. |
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Page 488
... thickness is reduced , eventually a condition is reached where the mean - free - path of molecules within the gas becomes significant with respect to the thickness of the film . In such a case , the effectiveness of damping is reduced ...
... thickness is reduced , eventually a condition is reached where the mean - free - path of molecules within the gas becomes significant with respect to the thickness of the film . In such a case , the effectiveness of damping is reduced ...
Page 606
... thickness , 01,2 is the stress for each layer and t1,2 is the corresponding thickness of each material . For a composite beam structure , the pull - in voltage technique determines Oc If 01 and each layer thickness is known in addition ...
... thickness , 01,2 is the stress for each layer and t1,2 is the corresponding thickness of each material . For a composite beam structure , the pull - in voltage technique determines Oc If 01 and each layer thickness is known in addition ...
Page 608
... thickness variation of 200Å can create a 40 % variation in the sensitivity . In general , a stress reduction of a factor of 6 is attainable before membrane buckling occurs . DESIGN EXAMPLE In order to verify the usefulness of the models ...
... thickness variation of 200Å can create a 40 % variation in the sensitivity . In general , a stress reduction of a factor of 6 is attainable before membrane buckling occurs . DESIGN EXAMPLE In order to verify the usefulness of the models ...
Contents
Early Papers in Micromechanics | 1 |
Valves and Pumps | 24 |
Side Drive Actuators | 145 |
Copyright | |
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alignment anisotropically etched applied bearing cantilever beam capacitance capacitor charge chip circuit comb components deflection density deposited detector diamagnetic diaphragm dielectric displacement doped drive elec electret electric field electrode electromechanical Electron Devices electrostatic actuators electrostatic force electrostatic motor etchant etching excitation fabrication fiber Figure friction geometry IEEE Micro IEEE Trans input insulation integrated layer levitation linear LPCVD magnetic mask material measured metal microactuators microdynamics micromechanical micromotor nitride operation optical optical fibers output oxide pattern phase plane plate pole faces polysilicon position potential radius ratio resistor rotation rotor scale Sensors and Actuators shape memory alloy shown in Fig side-drive motors silicon nitride silicon wafer SiO2 slider Solid-State Sensors stator stator poles structures substrate superconductor surface switch techniques temperature thermal thickness thin films tion torque Transducers valve voltage wire wobble motor Workshop Young's modulus