Glass, Volume 17Minoru Tomozawa, Robert Heward Doremus |
From inside the book
Results 1-3 of 8
Page 191
... Copper oxide contamination should also be avoided ( Suzuki et al . , 1972 , 1973 ) . Alkali and copper ions diffuse easily into the semiconductor element during processing and may cause a deterioration of the electrical characteristics ...
... Copper oxide contamination should also be avoided ( Suzuki et al . , 1972 , 1973 ) . Alkali and copper ions diffuse easily into the semiconductor element during processing and may cause a deterioration of the electrical characteristics ...
Page 201
... copper glasses were plotted in two ways : ( 1 ) Curves A and B of Fig . 15 show the behavior of Cu - containing glasses which were oxygen - bubbled at 1000 and 1100 ° C when the starting CuO batch content in Table XV is specified in the ...
... copper glasses were plotted in two ways : ( 1 ) Curves A and B of Fig . 15 show the behavior of Cu - containing glasses which were oxygen - bubbled at 1000 and 1100 ° C when the starting CuO batch content in Table XV is specified in the ...
Page 202
... copper ion system is to cause a small increase in the coefficient of thermal expansion with the increase in total copper content . 5. CHEMICAL DURABILITY OF SELECTED Glasses The chemical durability of the glasses in the present work was ...
... copper ion system is to cause a small increase in the coefficient of thermal expansion with the increase in total copper content . 5. CHEMICAL DURABILITY OF SELECTED Glasses The chemical durability of the glasses in the present work was ...
Contents
Solubility Models | 9 |
Effect of Experimental Variables on Gas Mobility in Vitreous Materials | 16 |
Phase Separation and Crystallization | 26 |
Copyright | |
18 other sections not shown
Common terms and phrases
activation energy addition alkali alkali ions alkali silicate glasses annealing atom band bleaching BOHC borate boron borosilicate glass cation Ceram Chem chemical durability components concentration crystallization curve decrease defect centers devitrifiable solder glasses Doremus effect ESR spectra eV band experimental Friebele fused silica glass surface glass systems glasses containing grinding Griscom heat treatment helium hole center hole trapped hydrogen hyperfine immiscibility immiscibility boundary increase indentation irradiation lapping hardness layer measured mole Na₂O Non-Cryst nonbridging oxygen nucleation observed optical absorption oxide glasses oxygen particle PbTiO3 permeability phase separation Phys polishing grains polishing rate powder properties radiation radiation-induced reaction samples Section Shelby shown in Fig silicate glasses SiO2 sodium softening point solder glass composites solubility spectrum spinodal decomposition structure studies Table Takamori thermal expansion coefficient tion Tomozawa U.S. Patent viscosity vitreous silica vitreous solder glass volume loss